Procesor server Intel Xeon E-2374G, socket 1200, 4C / 8T, 3.70 - 5.00 GHz, 8 MB cache, 80 W

	Processor
Processor cores	4
Processor cache	8 MB
Processor manufacturer	Intel
Thermal Design Power (TDP)	80 W
Processor lithography	14 nm
Processor cache type	Smart Cache
Processor family	Intel Xeon E
Box	N
Processor socket	LGA 1200 (Socket H5)
Cooler included	N
Processor base frequency	3.7 GHz
Processor model	E-2374G
System bus rate	8 GT/s
Processor threads	8
Processor operating modes	64-bit
Processor boost frequency	5 GHz
Component for	Server/workstation
	Technical details
Vendor	Intel
Status	Launched
Launch date	Q3''21
Supported memory types	DDR4-SDRAM
	Weight & dimensions
Processor package size	37.5 x 37.5 mm
	Other features
Maximum internal memory	128 GB
	Graphics
On-board graphics card base frequency	350 MHz
On-board graphics card dynamic frequency (max)	1300 MHz
Number of execution units	32
On-board graphics card 4K support	Y
On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel)	60 Hz
On-board graphics card refresh rate at maximum resolution (DisplayPort)	60 Hz
On-board graphics card refresh rate at maximum resolution (HDMI)	60 Hz
Maximum on-board graphics card memory	64 GB
On-board graphics card OpenGL version	4.5
Discrete graphics card	N
On-board graphics card model	Intel UHD Graphics P750
Discrete graphics card model	Not available
On-board graphics card	Y
	Processor special features
Intel® Quick Sync Video Technology	Y
Intel® InTru™ 3D Technology	Y
Intel® Clear Video HD Technology (Intel® CVT HD)	Y
Intel® AES New Instructions (Intel® AES-NI)	Y
Enhanced Intel SpeedStep Technology	Y
Intel Trusted Execution Technology	Y
Intel VT-x with Extended Page Tables (EPT)	Y
Intel® Secure Key	Y
Intel 64	Y
Intel® OS Guard	Y
Intel Virtualization Technology for Directed I (O (VT-d))	Y
Intel Clear Video Technology	Y
Intel Software Guard Extensions (Intel SGX)	Y
Intel Virtualization Technology (VT-x)	Y
Intel® Memory Protection Extensions (Intel® MPX)	Y
Intel® Boot Guard	Y
Intel® vPro™ Platform Eligibility	Y
Intel® Optane™ DC Persistent Memory Supported	N
Intel® Transactional Synchronization Extensions	N
Intel® Turbo Boost Technology 2.0 frequency	5 GHz
Maximum Enclave Size Support for Intel® SGX	0.5 GB
Intel® Hyper Threading Technology (Intel® HT Technology)	Y
Intel® Turbo Boost Technology	2.0
	Features
Execute Disable Bit	Y
Idle States	Y
Thermal Monitoring Technologies	Y
Scalability	1S
CPU configuration (max)	1
PCI Express configurations	1x16+1x4,2x8+1x4,1x8+3x4
Maximum number of PCI Express lanes	20
Market segment	Server
Harmonized System (HS) code	8542310001
Supported instruction sets	SSE4.1,SSE4.2,AVX 2.0,AVX-512
Export Control Classification Number (ECCN)	5A992CN3
Commodity Classification Automated Tracking System (CCATS)	G167599
PCI Express slots version	4.0
	Operational conditions
Tjunction	100 °C
	Memory
ECC	Y
Maximum internal memory supported by processor	128 GB
Memory types supported by processor	DDR4-SDRAM
Memory channels	Dual-channel
	Packaging data
Package type	Retail box

MODEL
Producator	Intel
Familie	Xeon E
Nucleu	Rocket Lake-E
Socket	1200
Model	Xeon E-2374G
Numar nuclee	4
Numar thread-uri	8
Frecventa	3.70 GHz
Frecventa turbo	5.00 GHz
Cache	8 MB
Tehnologie de fabricatie	14 nm
TDP	80 W
Grafica integrata	UHD Graphics P750
MEMORIE
Tip	DDR4 ECC
Frecventa	3200 MHz
Canale memorie	2
Memorie maxima	128 GB
CONECTICA
Versiune PCI Express	4.0
Cai PCI Express	20

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